Fabrication of Flexible Superconducting Wiring with High Current-Carrying Capacity Indium Interconnects

摘要

The X-ray integral field unit (X-IFU) is a cryogenic spectrometer for the Advanced Telescope for High ENergy Astrophysics (ATHENA). ATHENA is a planned next-generation space-based X-ray observatory with capabilities that surpass the spectral resolution of prior missions. Proposed device designs contain up to 3840 transition edge sensors, each acting as an individual pixel on the detector, presenting a unique challenge for wiring superconducting leads in the focal plane assembly. In prototypes that require direct wiring, the edges of X-IFU focal plane have hosted aluminum wirebonding pads; however, indium (In) ‘bumps’ deposited on an interface layer such as molybdenum nitride (MoN) can instead be used as an array of superconducting interconnects. We investigated bumped MoN:In structures with different process cleans and layer thicknesses. Measurements of the resistive transitions showed variation of transition temperature T ~(c)as a function of bias and generally differed from the expected bulk T ~(c)of In (3.41?K). Observed resistance of the In bump structures at temperatures below the MoN transition (at 8.0?K) also depended on the varied parameters. For our proposed X-IFU geometry (10?μm of In mated to a 1-μm In bump), we measured a minimum T ~(c)of 3.14?K at a bias current of 3?mA and a normal resistance of 0.59?mΩ per interconnect. We also investigated the design and fabrication of superconducting niobium (Nb) microstrip atop flexible polyimide. We present a process for integrating In bumps with the flexible Nb leads to enable high-density wiring for the ATHENA X-IFU focal plane.