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Radiation sustenance of HfO2/beta-Ga2O3 metal-oxide-semiconductor capacitors: gamma irradiation study

机译:HFO2 /β-GA2O3金属氧化物半导体电容器的辐射寄存:γ辐照研究

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摘要

beta-Ga2O3 is an interesting new generation wide bandgap semiconductor for power device applications. The gamma irradiation was performed on the HfO2/beta-Ga2O3-based metal-oxide-semiconductor capacitors at 1 kGy and 200 kGy doses. The leakage current density variation at -1 V is 3.47 x 10(-7) A cm(-2), 5.90 x 10(-7) A cm(-2) and 4.91 x 10(-6) A cm(-2) for the pristine, 1 kGy and 200 kGy devices, respectively. In the case of substrate injection, the Schottky emission mechanism appears to be dominant in the 0.65 to 2.0 MV cm(-1) electric field range. The barrier heights (Ni/HfO2/beta-Ga2O3) 0.95 eV, 0.86 eV and 0.83 eV were extracted from Schottky emission for the pristine, 1 kGy and 200 kGy doses, respectively. However, as the dose increases to 200 kGy, the charge-trapping favors the trap-assisted Poole-Frenkel (PF) tunneling mechanism. In this case, the PF emission mechanism seems to be dominant for the pristine and 1 kGy in the range of 2.0-4.0 MV cm(-1), whereas for 200 kGy it is 1.45 to 4.0 MV cm(-1) which indicates that the defect assisted PF tunneling is predominant at 200 kGy irradiation dose. There is an increase in the density of oxide traps (D-ot) changes from 1.14 x 10(12) cm(-2) eV(-1) to 1.47 x 10(12) cm(-2) eV(-1), and the density of interface traps has increased from 1.95 x 10(11) cm(-2) eV(-1) to 3.80 x 10(11) cm(-2) eV(-1) for the pristine and 200 kGy samples, respectively. The peaks of Photoluminescence show that the three bands of defects centered at 3.0, 2.7 and 2.2 eV. These peaks have possibly arisen from the vacancies of oxygen. At 200 kGy high dose, the defect band emissions were found at 2.9, 2.6 eV and a broad emission at 2.1 eV indicates the increase in the denisty of oxide-trapped charges within the HfO2 layer.
机译:Beta-Ga2O3是一种有趣的新一代宽带隙半导体,用于电力设备应用。在1kGy和200kgy剂量上对基于HFO2 /β-GA2O3的金属氧化物 - 半导体电容进行γ辐射。 -1V的漏电流密度变化为3.47×10(-7)厘米(-2),5.90×10(-7)A cm(-2)和4.91×10(-6)厘米(-2 )对于原始,1 kgy和200 kgy设备。在基板注射的情况下,肖特基排放机构似乎在0.65至2.0mVcm(-1)电场范围内占主导地位。屏障高度(Ni / HFO2 /β-GA2O3)0.95eV,0.86eV和0.83eV分别从肖特基排放分别用于原始,1kGy和200kgy剂量。然而,随着剂量增加到200 kgy,电荷捕获有利于陷阱辅助普尔弗雷克尔(PF)隧道机构。在这种情况下,PF排放机制似乎是初始和1kGy的主要占优势2.0-4.0 mV cm(-1),而200kgy为1.45至4.0 mV cm(-1),表示缺陷辅助PF隧道在200吨杆照射剂量下是主要的。氧化物疏水阀(D-OT)的密度增加,从1.14×10(12)cm(-2)eV(-1)至1.47×10(12)cm(-2)EV(-1) ,界面陷阱的密度从1.95×10(11)厘米(-2)厘米(-2)厘米(-1)厘米增加到3.80×10(11)厘米(-2)EV(-1),用于原始和200 kgy样本, 分别。光致发光的峰表明,在3.0,2.7和2.2eV中以3.0,2.7和2.2eV为中心的三个带。这些峰可能从氧气空位中出现。在200 kgy高剂量,缺陷带排放在2.9,2.6eV和2.1eV的广泛发射中,表明HFO2层内氧化血管截止电荷的增加。

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