Growth dynamics of copper thin film deposited by soft-landing of size selected nanoclustersk

摘要

We investigate surface kinetic roughening of copper films grown on Si(1 0 0) substrates at room temperature by means of atomic force microscopy study. Films were deposited at various durations by soft landing of size selected (similar to 3 nm) nanoclusters using a state of the art nanocluster deposition system. The film growth exhibits two growth regimes with a crossover time of 40 min. In the first regime, surface morphologies show bimodal distribution and surface roughness shows a linear increase with growth exponent beta = 0.14 +/- 0.02. In the second regime, the height distribution becomes Gaussian and surface roughness shows a steep rise with high beta value 0.83 +/- 0.45. On the other hand, the roughness exponent alpha ranges from 0.68 +/- 0.03 to 0.84 +/- 0.01 for low to high deposition regimes. Estimated scaling exponent suggests the diffusion of clusters on substrate surface and shadowing effect play dominant role in growth mechanism of the nanostructured thin film.