机译:采用浸渍镀镀镀金印刷电路板灌装压力灌装压力对血糖试验条性能的影响
Graduate Institute of Manufacturing Technology National Taipei University of Technology Taipei Taiwan;
Graduate Institute of Manufacturing Technology National Taipei University of Technology Taipei Taiwan;
Graduate Institute of Manufacturing Technology National Taipei University of Technology Taipei Taiwan;
Department of Electrical Engineering Lee-Ming Institute of Technology New Taipei City Taiwan;
Graduate Institute of Manufacturing Technology National Taipei University of Technology Taipei Taiwan;
Graduate Institute of Manufacturing Technology National Taipei University of Technology Taipei Taiwan;
Blood glucose; jetting dispenser; glucose sensor; electrode; filling pressure;
机译:采用浸渍镀镀镀金印刷电路板灌装压力灌装压力对血糖试验条性能的影响
机译:从印刷电路板回收黄金在“温和的Aqua Regia”系统中镀金废物手机层
机译:高盐度大气环境中镀金印刷电路板的微孔腐蚀行为
机译:喷射分配器的针头组件滑动对血糖试纸特性的影响
机译:带有WCSP封装的定制印刷电路板的板级抗弯可靠性测试和故障分析。
机译:薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
机译:关联互连应力测试和加速热循环,以获取高性能印刷电路板的可靠性