前处理工艺对印刷线路板表面化学镀镍/置换镀金层性能的影响

摘要

分析了酸洗、微刻蚀及活化等前处理工艺对印刷线路板(PCB)表面化学镀镍/置换镀金层性能的影响.结果表明:备前处理工序对PCB表面性能具有较大影响,在此基础上得到了优化后的前处理工艺.%The effects of the pretreatment processes (such as acid cleaning, micro-etching and activation) on the properties of electroless nickel/immersion gold coating on the surface of printed circuited board (PCB) were analyzed. The results show that each of the pretreatment processes has a greater influence on the surface properties of PCB. On this basis, an optimal pretreatment process is obtained.