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Synthesis of novel thermosetting imide compounds having phenylethynyl carbonyl groups at both terminal ends and production of new network polymers based on the imide compounds

机译:在两个末端具有苯基乙炔基羰基的新型热固性酰亚胺化合物的合成和基于酰亚胺化合物的新网络聚合物的生产

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摘要

A novel thermosetting imide compound having a respective phenylethynyl carbonyl group at both terminal ends was newly synthesized from an acid anhydride having a phenylethynyl carbonyl group and various diamine compounds. The thermosetting behavior of the obtained novel thermosetting imide compound having phenylethynyl carbonyl groups was analyzed through differential scanning calorimetry measurements and infrared spectroscopic analysis. As a result, it became clear that a curing reaction of phenylethynyl carbonyl groups proceeds at approximately 200 degrees C and that the curing reaction thereof proceeds at a temperature that is lower by 150 degrees C or more compared with that of phenylethynyl groups. Examination of the polymerization reaction of the imide compounds having phenylethynyl carbonyl groups using model compounds revealed that a reaction that imparted an alkene C=C and polycyclic aromatic structure progressed. Moreover, a network polymer obtained from a thermosetting imide compound having respective phenylethynyl carbonyl groups at both terminal ends exhibited extremely superior heat resistance and thermal decomposition resistance. These superior thermal properties are thought to be due to the strong molecular interaction (molecular packing) that results from the polycyclic aromatic structures and alkenes produced through polymerization of the phenylethynyl carbonyl groups and to the suppression of the movement of the molecular chains.
机译:在具有苯基乙炔基羰基和各种二胺化合物的酸酐中,新合成具有两种末端的相应苯基乙炔基羰基的新型热固性酰亚胺化合物。通过差示扫描量热法测量和红外光谱分析分析所获得的新型热固性酰亚胺化合物的热固性酰亚胺化合物的热固性行为。结果,尽管苯乙炔基羰基的固化反应在约200摄氏度下进行,并且其固化反应在与苯基乙炔基相比低150℃或更高的温度下进行。使用模型化合物对具有苯基乙炔基羰基的酰亚胺化合物的聚合反应显示,赋予烯烃C = C和多环芳族结构的反应。此外,从两个末端的具有相应苯基乙炔基羰基的热固性酰亚胺化合物获得的网络聚合物表现出极高的耐热性和热分解性。这些优异的热性能被认为是由于通过通过聚合苯基乙炔基羰基的聚合和抑制分子链的运动来产生的强分子相互作用(分子包装)。

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