Adhesive and Composite Properties of Cured Imide Oligomers Containing Pendent and Terminal Phenylethynyl Groups

摘要

As part of a program to develop high performance/high temperature structural resins for aeronautical applications, imide oligomers with calculated number average molecular weights of -5000 g/mole containin pendent and terminal phenylethynyl groups were prepared, characterized, thermally cured and the cured resins evaluated as adhesives and composite matrix resins. The chemical structure of the oligomer backbone was altered to obtain a resin with an attractive combination of properties including processability using conventional equipment, high emchanical propertis and microcrack resistance.