FLUORINE-CONTAINING THERMOSETTING BISIMIDE COMPOUND, ITS INTERMEDIATE, THEIR PRODUCTION AND FLUORINE-CONTAINING THERMOSETTING IMIDE RESIN MATERIAL

摘要

PURPOSE:To provide a new fluorine-containing thermosetting bisimide compound useful in a wide field extending from electronic materials to astronautic materials as a raw material for thermosetting polyimide having low water- absorption as well as excellent heat-resistance. CONSTITUTION:The compound of formula [Rf is CnF2n-1 (n is integer of 6-12) which contains one double bond and may be arbitrarily branched; the H atoms of the aromatic ring may be substituted; two imide groups are bonded to the aromatic ring at ortho, meta or para position relative to the ether bond; D is dicarboxylic acid residue having ethylenic unsaturated double bond], e.g. 1,3-bismaleimide-5-(perfluorononenyloxy)benzene. The objective compound can be produced by reacting a compound of formula II with a compound of formula III and cyclizing the obtained new intermediate of formula IV.