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首页> 外文期刊>SIAM journal on applied dynamical systems >Growth and characterisation of n- and p-type ZnTe thin films for applications in electronic devices
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Growth and characterisation of n- and p-type ZnTe thin films for applications in electronic devices

机译:用于电子设备应用的N和P型ZnTe薄膜的生长和表征

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The growth of n- and p-type ZnTe thin films have been achieved intrinsically by potentiostatic electrodeposition method using a 2-electrode system. Cyclic voltammogram have been used to obtain range of growth voltages required to form stoichiometric thin films of ZnTe. The ZnTe thin films have been electrodeposited (ED) on glass/fluorine-doped tin oxide (FTO) conducting substrates in aqueous solutions of ZnSO4 center dot 7H(2)O and TeO2. The films have been characterised for their structural, electrical, morphological, compositional and optical properties by using X-ray diffraction (XRD), Raman spectroscopy, Photo-electrochemical (PEC) cell measurements, DC conductivity measurements, Scanning electron microscopy (SEM), Atomic force microscopy (AFM), energy-dispersive X-ray analysis (EDX) and Optical absorption techniques. The XRD results reveal that the electroplated films are polycrystalline and have hexagonal crystal structure with the preferred orientation along (002) plane. UV-Visible spectrophotometer has been used for the bandgap determination of as-deposited and heat-treated ZnTe layers. The bandgap of the heat-treated ZnTe films are in the range (1.90-2.60) eV depending on the deposition potential. PEC cell measurements show that the ED-ZnTe films have both n- and p-type electrical conductivity. The DC conductivity measurements revealed that the average resistivity of n-ZnTe and p-ZnTe layers of equal thickness is of the order of 10(4) Omega cm; the magnitude of the electrical resistivity of p-ZnTe is almost five times greater than that of the n-ZnTe layer. Using the n- and p-type ZnTe layers, p-n homo-junction diodes with device structure of glass/FTO/n-ZnTe/p-ZnTe/Au were fabricated. The fabricated diodes showed rectification factor of 10(2), reverse saturation current of similar to 10.0 nA and potential barrier height greater than 0.77 eV indicating electronic device quality of these layers. (C) 2015 Elsevier B.V. All rights reserved.
机译:使用2电极系统的电位电沉积方法本质上实现了N-和P型ZnTe薄膜的生长。循环伏安图已被用于获得形成ZnTe的化学计量薄膜所需的生长电压范围。在ZnSO4中心点7h(2)O和TEO2的玻璃/氟掺杂的氧化锡(FTO)上,在玻璃/氟掺杂的氧化锡(FTO)上进行电沉积薄膜(ED)。通过使用X射线衍射(XRD),拉曼光谱,光电化学(PEC)电化学(PEC)电池测量,DC电导率测量,扫描电子显微镜(SEM),已经表征了它们的结构,电气,形态,组成和光学性能,即通过使用X射线衍射(XRD),扫描电子显微镜(SEM)。原子力显微镜(AFM),能量分散X射线分析(EDX)和光学吸收技术。 XRD结果表明,电镀薄膜是多晶,具有六边形晶体结构,具有沿(002)平面的优选取向。 UV可见分光光度计已被用于用于沉积和热处理的ZnTe层的带隙测定。根据沉积电位,热处理的ZnTe膜的带隙在于(1.90-2.60)。 PEC细胞测量表明,ED-Znte膜具有N-和P型电导率。直流电导率测量表明,相等厚度的N-ZnTe和P-ZnTe层的平均电阻率为10(4)ωCm; P-ZnTe的电阻率的大小几乎大于N-ZnTe层的五倍。使用N-和P型Znte层,制造了具有玻璃/ FTO / N-ZnTe / P-ZnTe / Au的装置结构的P-N均结二极管。制造的二极管显示出10(2)的整流因子,类似于10.0 NA的反向饱和电流,并且潜在的屏障高度大于0.77eV表示这些层的电子器件质量。 (c)2015 Elsevier B.v.保留所有权利。

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