Electrodeposition of nickel coatings in choline chloride: ethylene glycol deep eutectic solvent

摘要

The electrodeposition and morphology of nickel coatings deposited po-tentiostatically in (2-hydroxyethyl)trimethylammonium chloride : ethylene glycol (1:2 molar ratio) eutectic solvent on copper substrate were investigated. In the presence of 1 mol dm~(-3) NiCI_2-6H_2O the reduction of nickel at 25 °C takes place at potentials more negative than -0.4 V vs. Ag quasi-reference electrode. It was found that the morphology and structure of nickel coatings are strongly affected by deposition potential. In the investigated system, electrodeposition at ambient temperature and at the potentials between -0.6 and -0.8 V vs. Ag results in compact nickel coatings devoid of visible defects.