首页> 外文期刊>Crystal Research and Technology: Journal of Experimental and Industrial Crystallography >N-GaN column arrays on the vertical InGaN/GaN blue LEDs formed by maskless dry etching
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N-GaN column arrays on the vertical InGaN/GaN blue LEDs formed by maskless dry etching

机译:通过无掩模干法刻蚀形成的垂直InGaN / GaN蓝色LED上的N-GaN列阵列

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摘要

The InGaN/GaN blue light emitting diodes (LED) structures have been grown on sapphire substrates with a hexagonal array of hemispherical patterns by low-pressure metalorganic chemical vapor deposition. Vertical LED structures on Cu carriers are fabricated using electroplating and KrF laser lift-off techniques. After removal of the patterned sapphire substrate, an inductively coupled plasma etching is carried out to expose the n-GaN layer for n-metal contact. It is observed that GaN columns are formed at the center of the concave hemispheres after dry etching processes. Cathodoluminescence and wet chemical etching investigations reveal that a high density of dislocations is found to be generated at these specific positions. The possible mechanism for these observations is attributed to the defect distribution and defect-dependent selective etching of the GaN.
机译:通过低压金属有机化学气相沉积,已在具有半球形图案的六边形阵列的蓝宝石衬底上生长了InGaN / GaN蓝色发光二极管(LED)结构。铜载体上的垂直LED结构是使用电镀和KrF激光剥离技术制造的。在去除图案化的蓝宝石衬底之后,进行电感耦合等离子体蚀刻以暴露用于n金属接触的n-GaN层。观察到,在干法刻蚀工艺之后,GaN柱形成在凹半球的中心。阴极发光和湿化学蚀刻研究表明,在这些特定位置处产生高密度的位错。这些观察的可能机制归因于GaN的缺陷分布和与缺陷有关的选择性蚀刻。

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