机译:通过热压印和热粘合制造SU-8光致抗蚀剂微纳米流体芯片的制造
Dalian Univ Technol Key Lab Precis &
Nontradit Machining Technol Minist Educ Dalian Peoples R China;
Dalian Univ Technol Key Lab Precis &
Nontradit Machining Technol Minist Educ Dalian Peoples R China;
Dalian Univ Technol Dept Biomed Engn Dalian Peoples R China;
Dalian Univ Technol Key Lab Precis &
Nontradit Machining Technol Minist Educ Dalian Peoples R China;
Dalian Univ Technol Key Lab Precis &
Nontradit Machining Technol Minist Educ Dalian Peoples R China;
Jilin Univ Sch Mech Sci &
Engn Changchun Peoples R China;
Dalian Univ Technol Key Lab Micro Nano Technol &
Syst Liaoning Prov Dalian Peoples R China;
Dalian Univ Sch Phys Sci &
Technol Dalian Peoples R China;
Dalian Univ Technol Key Lab Precis &
Nontradit Machining Technol Minist Educ Dalian Peoples R China;
机译:通过热压印和热粘合制造SU-8光致抗蚀剂微纳米流体芯片的制造
机译:UV辅助热压印不透明模具对SU-8光致抗蚀剂的微结构化
机译:使用纳米压印光刻技术和低压热粘合方法制造尺寸可控的SU-8纳米通道
机译:使用可热分解的临时粘接剂制造超薄硅芯片
机译:通过基于DMD的微立体光刻技术和光热压印技术对聚合物材料进行微/纳米加工。
机译:利用热压花和热粘合技术制备二维聚对苯二甲酸乙二醇酯纳米流体芯片
机译:使用聚甲基丙烯酸甲酯层的组合热和压力键合的自主环境分析器的粗糙和可靠流体芯片的制造
机译:用NOR-Ti-Bond工艺制造钛热保护系统面板