Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive

摘要

A technical challenge in fabrication of ultra-thin sensor chip (UTSC) is to keep chip integrity in debonding the ultra-thin chips from grinding facilities. This paper presents a new debonding method by utilizing a thermally decomposable polypropylene carbonate (PPC), as the temporary bonding adhesive. Because PPC can readily decompose at relatively low temperature, this method can maintain the chip integrity even the chips have a thickness of tens of microns. UTSCs with thickness of 30μm have been achieved using this method, and stress sensors have been developed to verify the performance of UTSC. The experimental results show that the proposed method is able to fabricate UTSC with good flexibility and characterizations, demonstrating the newly proposed method an enabling technology for fabrication of sensors for flexible and wearable applications.