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首页> 外文期刊>Materials science in semiconductor processing >Influence of 4H-SiC substrate miscut on the epitaxy and microstructure of AlGaN/GaN heterostructures
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Influence of 4H-SiC substrate miscut on the epitaxy and microstructure of AlGaN/GaN heterostructures

机译:4H-SiC衬底乳斑对AlGaN / GaN异质结构外延和微观结构的影响

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摘要

AlGaN/GaN heterostructures were grown on "on-axis" and 2 degrees off (0001) 4H-SiC substrates by metalorganic vapor phase epitaxy (MOVPE). Structural characterization was performed by transmission electron microscopy. The dislocation density, being greater in the on-axis case, is gradually reduced in the GaN layer and is forming dislocation loops in the lower region. Steps aligned along [1 (1) over bar 00] in the off-axis case give rise to simultaneous defect formation. In the on-axis case, an almost zero density of steps is observed, with the main origin of defects probably being the orientation mismatch at the grain boundaries between the small not fully coalesced AlN grains. V-shaped formations are observed in the AlN nucleation layer, but are more frequent in the off-axis case, probably enhanced by the presence of steps. These V-shaped formations are completely overgrown by the GaN layer, during the subsequent deposition, presenting AlGaN areas in the walls of the defect, indicating an inter-diffusion between the layers. Finally, at the AlGaN/GaN heterostructure surface in the on-axis case, V-shapes are observed, with the AlN spacer and AlGaN (21% Al) thickness on relaxed GaN exceeding the critical thickness for relaxation. On the other hand, no relaxation in the form of V-shape creation is observed in the off-axis case, probably due to the smaller AlGaN thickness (less than 21% Al). The AlN spacer layer, grown in between the heterostructure, presents a uniform thickness and clear interfaces.
机译:通过金属有机气相外延(MOVPE)在“轴上”和2度OFF(0001)4H-SiC基板上生长AlGaN / GaN异质结构。通过透射电子显微镜进行结构表征。在轴上壳体中更大的位错密度在GaN层中逐渐减小,并且在下部区域形成位错环。沿着[1(1)在轴外壳中沿[1(1))对准的步骤产生了同时缺陷的形成。在轴上的情况下,观察到几乎零密度的步骤,主要缺陷可能是小不完全聚结的ALN晶粒之间的晶界处的定向不匹配。在ALN成核层中观察到V形形成,但在轴外壳中更频繁地频繁,可能通过步骤的存在而增强。在随后的沉积期间,通过GaN层完全覆盖这些V形形成,呈现缺陷壁中的AlGaN区域,表示层之间的间隙。最后,在轴壳体中的AlGaN / GaN异质结构表面上,观察到V形,并且AlN间隔物和AlGaN(21%Al)厚度超过放松的临界厚度以进行松弛。另一方面,在轴外壳体中观察到V形创建形式的弛豫,可能是由于较小的AlGaN厚度(小于21%)。在异质结构之间生长的ALN间隔层呈均匀的厚度和透明的界面。

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