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Effect of SiC buffer layer on flux pinning property of MgB2 tapes

机译:SiC缓冲层对MGB2胶带的磁通钉钉子性能的影响

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摘要

In this paper we aimed at investigating the flux pinning property of MgB2 films on hastelloy tapes which are buffered on various thicknesses of SiC layers. We have observed that the increase in thickness of the SiC buffer layer is very closely related with the systematic improvement of the field dependence of the critical current densities (J(c)) of MgB 2 tapes while the values of J(c) decreased. According to the analysis of the pinning force density (F-p), there exist two pinning sources both in the pure MgB2 and in the MgB2 film with the thinnest SiC buffer layer. On the while, the pinning source observed in the MgB2 films with thicker SiC buffer layers appears to be different from those previously mentioned. The different pinning behaviors of MgB2 films may suggest that there be an additional pinning center working on the MgB2 films with thick SiC buffer layers. The microstructural analyses of MgB2 films confirmed that intra-granular defects and columnar grain boundaries may be a dominant pinning mechanism in the pure MgB2 and the MgB2 film with 170 nm-thick SiC buffer layer. For the MgB2 films with thicker SiC buffer layers, carbon diffusion into the MgB2 film, which is defined by the Auger electron spectroscopy, may be the origin of the additional pinning mechanism.
机译:在本文中,我们旨在研究在SIC层的各种厚度上缓冲的哈氏合金带上的MGB2薄膜的磁通钉钉。我们观察到,SiC缓冲层的厚度的增加与系统改善MGB 2胶带的临界电流密度(J(C))的场依赖性的系统改善,而J(c)的值降低。根据钉扎力密度(F-P)的分析,在纯MGB2和MGB2膜中存在两种钉扎源,与最薄的SiC缓冲层。虽然,在具有较厚的SiC缓冲层的MGB2膜中观察到的钉源源看起来与先前提到的膜不同。 MGB2薄膜的不同钉扎行为可能表明,在具有厚的SiC缓冲层的MGB2薄膜上有一个额外的钉扎中心。 MGB2薄膜的微观结构分析证实,粒状缺陷和柱状晶界可以是纯MGB2和170nm厚的SiC缓冲层中的MGB2膜中的主要钉扎机制。对于具有较厚的SiC缓冲层的MGB2膜,由螺旋钻电子光谱法定义的MGB2膜中的碳扩散可以是附加钉扎机构的来源。

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