Openair Plasma for Adhesive Bonding and Sealing in Electronics Production

摘要

"We expect to see an increasing number of bonding and sealing applications in the electronics industry in the future," says Nico Coenen, Business Development Manager Electronics Market at Plasmatreat, assessing the developments in his sector. With regard to the subject of sealing, the focus is on device construction, in which environmentally friendly and electromagnetically compatible (EMC) seals are used to protect the electronics against a wide variety of influences. "In this case, pre-treatment using openair plasma technology can be decisive in ensuring a stable bond between the metal or plastic housing and the seal," Coenen explains.