A foamable electricity and heat conducting sealant and adhesive useful for sealing and adhesive bonding of electronic equipment and mobile phone housings has higher electrical conductivity than a non-in situ foam

摘要

A foamable electricity and heat conducting sealant and adhesive containing: (a) a foamable plastic and an adjuvant for sealing and adhesion; (b) an electrically conducting filler, and (c) a gas or gas forming material for foaming is new. An Independent claim is included for preparation of a sealant and adhesive by mixing components (a) to (c) to give a viscous paste, with addition of the gas-forming material or gas.