Hybrid Bonding (Plasma activation and Anodic bonding) for Vacuum Sealing

摘要

Low temperature bonding by means of plasma activated bonding has been proposed. However there are the following problems for the mass-production of devices. Voids occur due to small particles remaining at the interface, Low bond strength in case of bonding in a vacuum. In this article we introduce the 'Hybrid Bonding' method for a combination of plasma activation and anodic bonding. This method may overcome the problems and be suitable for mass-production of MEMS devices.