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首页> 外文期刊>Journal of Materials Chemistry, A. Materials for energy and sustainability >Atmospheric pressure chemical vapor deposition of methylammonium bismuth iodide thin films
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Atmospheric pressure chemical vapor deposition of methylammonium bismuth iodide thin films

机译:甲基铋碘化物薄膜的大气压化学气相沉积

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We demonstrate the atmospheric pressure chemical vapor deposition of methyl ammonium bismuth iodide ((CH3NH3)(3)Bi2I9 or MA(3)Bi(2)I(9)) films. MA(3)Bi(2)I(9) possesses an indirect optical bandgap of 1.80 eV and a room temperature excitonic peak at 511 nm. In contrast to recent reports, the films are n-type semiconductors with a room temperature carrier concentration of 3.36 x 10(18) cm(-3) and a Hall mobility of 18 cm(2) V-1 s(-1), which are superior to those of solution-processed, undoped films. The precursors used for the deposition are methylammonium iodide and bismuth iodide which are co-sublimated at 199 degrees C and 230 degrees C, respectively, in an Ar flow inside a tube furnace with a variable temperature profile. The substrate temperature is set at 160 degrees C, and dense polycrystalline films (similar to 775 nm thick) are deposited. Extensive characterization combined with first-principles density functional theory calculations unravels the synthesis-structure-property relationship in these films. The degradation of properties under ambient conditions results from film oxidation with a characteristic bi-exponential decay in resistivity, signifying a fast surface oxidation followed by a slower oxidation of the bulk.
机译:我们证明了甲基铵铋((CH 3 NH 3)(3)BI2I9或MA(3)BI(2)I(9))薄膜的大气压化学气相沉积。 MA(3)BI(2)I(9)具有1.80eV的间接光学带隙,在511nm处具有1.80eV和室温激发峰。与最近的报道相比,薄膜是N型半导体,室温载体浓度为3.36×10(18)厘米(-3),18cm(2)V-1s(-1)的霍尔迁移率,这优于溶液加工,未掺杂的薄膜。用于沉积的前体是甲基碘化甲基碘化物和碘化物,其在具有可变温度曲线的管炉内的AR流中,分别在199摄氏度和230℃下共聚。基板温度设定为160℃,沉积致密的多晶膜(类似于775nm厚)。结合第一原理函数理论计算结合的广泛表征无助于这些薄膜中的合成结构性关系。在环境条件下的性质降解是由薄膜氧化具有特征双指数衰减的电阻率,表示快速表面氧化,然后表示散装较慢的氧化。

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