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首页> 外文期刊>Journal of nanoscience and nanotechnology >Hierarchical Multi-Diameter Single-Crystal Silicon Nanowires by Successive Wet Chemical Etching
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Hierarchical Multi-Diameter Single-Crystal Silicon Nanowires by Successive Wet Chemical Etching

机译:连续湿化学蚀刻等分层多直径单晶硅纳米线

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摘要

A simple and low cost top-down wet chemical etching method was developed to fabricate hierarchical multi-diameter well-ordered single-crystal silicon nanowires. The procedure starts with forming single diameter silicon nanowire arrays by using nanosphere lithography and metal-assisted chemical etching of single crystal silicon wafer, which is followed by anisotropic radial etching of the wires. Successive repetitions of these etching steps result in arrays of multi-diameter single crystal nanowires. This technique can allow engineering nanowires in a hierarchical three-dimensional geometry for the development of advanced nano devices.
机译:开发了一种简单而低的降压湿化学蚀刻方法,用于制造分层多直径井有序的单晶硅纳米线。 该过程开始通过使用单晶硅晶片和金属辅助化学蚀刻形成单晶硅晶片的单级光刻和金属辅助化学蚀刻,其次是线的各向异性径向蚀刻。 这些蚀刻步骤的连续重复导致多直径单晶纳米线的阵列。 该技术可以允许工程纳米线在分层三维几何形状中用于开发先进的纳米器件。

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