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机译:低银Sn-0.3Ag-0.7Cu-1.6Bi-0.2IN焊点的电迁移行为
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn 100 Ping Le Yuan Beijing 100124 Peoples R China;
Sn0; 3Ag0; 7Cu-Bi-In solder joints; Bi; In; crystal orientation; IMC;
机译:低银Sn-0.3Ag-0.7Cu-1.6Bi-0.2IN焊点的电迁移行为
机译:Sn-58Bi焊点在不同电流密度和温度下的电迁移行为
机译:锡中c轴取向对三晶Sn-3.0Ag-0.5Cu焊点中电迁移行为的主导作用
机译:焊点中预先存在的空隙对Cu / Sn58Bi / Cu接头电迁移行为的影响
机译:SNBI系统的电迁移行为:对低温焊点可靠性的影响
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:使用四个故障标准的低银BGA焊点可靠性分析