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机译:高温老化期间Ni-Sn瞬态液相烧结粘合的微观结构演化
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Mat Sci &
Engn 30 Xueyuan Rd Beijing 100083 Peoples R China;
Transient liquid-phase sintering; intermetallic; microstructural evolution; high-temperature aging; thermal stability;
机译:高温老化期间Ni-Sn瞬态液相烧结粘合的微观结构演化
机译:热老化过程中瞬态液相烧结关节的微观结构演化与机械可靠性
机译:使用两种不同的Ni-B基填充材料的双相不锈钢瞬态液相键合过程中的组织演变和键合行为
机译:新一代半导体电力电子器件的高温耐耐耐力Ni-Sn瞬态液相烧结键合
机译:瞬态液相键合作为高温电力电子设备的连接技术。
机译:激光烧结液相烧结羟基磷灰石的组织演变和力学性能改进
机译:Al interlayer对Ni-Sn瞬态液相粘接的半导体模侧接头热循环可靠性的影响
机译:液相烧结过程中的组织发展与演变