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首页> 外文期刊>Journal of Electronic Materials >ECV Doping Profile Measurements in Silicon Using Conventional Potentiostat
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ECV Doping Profile Measurements in Silicon Using Conventional Potentiostat

机译:使用常规电位ostat在硅中的ECV掺杂轮廓测量

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摘要

Formation of p-n junctions by phosphorus diffusion from liquid dopant in Si was investigated using a custom-built procedure for performing electrochemical capacitance-voltage (ECV) measurements. The feasibility of using a potentiostat equipped with an impedance module was investigated using an algorithm and experimental setup developed for the ECV technique. Using impedance spectroscopy and amperometry methods in a controlled manner, the dopant concentration was measured in the depth range of 600 nm to 900 nm. Sequential etching in NH4F (0.1 M) electrolyte using current-time (I-t) testing under ultraviolet (UV) illumination was applied to etch the surface of n-type silicon and estimate the diffusion depth. Initial current-voltage (I-V) tests were used to determine the bias voltage. The results of the proposed method were compared with those obtained using a commercially available ECV profiler. A conventional parallel equivalent circuit model of the Schottky junction was used to describe the electrolyte-silicon barrier, leading to good agreement between the proposed method and commercial ECV analysis results.
机译:采用用于执行电化学电容 - 电压(ECV)测量的定制程序,研究了通过Si中磷掺杂剂的磷掺杂剂的磷扩散形成P-N结。使用为ECV技术开发的算法和实验设置研究了使用配备有阻抗模块的电位器的可行性。在受控方式使用阻抗光谱和安培测定方法,在600nm至900nm的深度范围内测量掺杂剂浓度。使用紫外线(UV)照射下使用电流 - 时间(I-T)测试的NH4F(0.1M)电解质顺序蚀刻,以蚀刻n型硅的表面并估计扩散深度。初始电流 - 电压(I-V)测试用于确定偏置电压。将所提出的方法的结果与使用市售ECV分析仪获得的结果进行比较。使用肖特基交界处的传统并行等效电路模型来描述电解质 - 硅屏障,从而达到所提出的方法和商业ECV分析结果之间的良好一致性。

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