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Doping profile measurements in silicon using terahertz time domain spectroscopy (THz-TDS) via electrochemical anodic oxidation.

机译:使用太赫兹时域光谱(THz-TDS)通过电化学阳极氧化法测量硅中的掺杂分布。

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摘要

Doping profiles are engineered to manipulate device properties and to determine electrical performances of microelectronic devices frequently. To support engineering studies afterward, essential information is usually required from physically characterized doping profiles.;Secondary Ion Mass Spectrometry (SIMS), Spreading Resistance Profiling (SRP) and Electrochemical Capacitance Voltage (ECV) profiling are standard techniques for now to map profile. SIMS yields a chemical doping profile via ion sputtering process and owns a better resolution, whereas ECV and SRP produce an electrical doping profile detecting free carriers in microelectronic devices. The major difference between electrical and chemical doping profiles is at heavily doped regions greater than 1020 atoms/cm3. At the profile region over the solubility limit, inactive dopants induce a flat plateau and detected by electrical measurements only. Destructive techniques are usually designed as stand-alone systems to study impurities. For an in-situ process control purpose, non-contact methods, such as ellipsometry and non-contact capacitance voltage (CV) techniques are current under development.;In this theses work, terahertz time domain spectroscopy (THz-TDS) is utilized to achieve electrical doping profile in both destructive and non-contact manners. In recent years the Terahertz group at Rochester Institute Technology developed several techniques that use terahertz pulses to non-destructively map doping profiles. In this thesis, we study a destructive but potentially higher resolution version of the terahertz based approach to map the profile of activated dopants and augment the non-destructive approaches already developed. The basic idea of the profile mapping approach developed in this MS thesis is to anodize, and thus oxidize to silicon dioxide, thin layers (down to below 10 nm) of the wafer with the doping profile to be mapped. Since the dopants atoms and any free carriers in the silicon oxide thin film are invisible to the terahertz probe this anodization step very effectively removes a 'thin slice' from the doping profile to be mapped. By iterating between anodization and terahertz measurements that detect only the 'remaining' non-oxidized portion of the doping profile one can re-construct the doping profile with significantly higher precision compared to what is possible by only a single non-destructive measurement of the un-anodized profile as used in the non-destructive version of our technique.;In this MS thesis we explore all aspects of this anodization based variation of doping profile mapping using free space terahertz pulses. This includes a study of silicon dioxide thin film growth using a room temperature electrochemical oxidation process. Etching procedures providing the option to remove between successive anodization and terahertz measurement steps. THz-TDS measurements of successively anodized profiles will be compared with sheet resistance and SIMS measurements to benchmark and improve the new technique.
机译:掺杂分布图经设计可操纵器件的性能并经常确定微电子器件的电性能。为了支持以后的工程研究,通常需要物理表征的掺杂分布图的基本信息。二次离子质谱(SIMS),扩展电阻分布图(SRP)和电化学电容电压(ECV)分布图是现在映射分布图的标准技术。 SIMS通过离子溅射工艺产生化学掺杂轮廓,并具有更好的分辨率,而ECV和SRP产生电掺杂轮廓,可检测微电子器件中的自由载流子。电和化学掺杂分布之间的主要区别是在大于1020原子/ cm3的重掺杂区域。在超过溶解度极限的轮廓区域,非活性掺杂剂会引起平坦平台,仅通过电学测量即可检测到。破坏性技术通常被设计为研究杂质的独立系统。为了实现现场过程控制,目前正在开发非接触方法,例如椭圆偏振法和非接触电容电压(CV)技术。在这些工作中,利用太赫兹时域光谱(THz-TDS)以破坏性和非接触方式实现电掺杂分布。近年来,罗彻斯特研究所技术研究所的太赫兹小组开发了几种技术,这些技术使用太赫兹脉冲无损地绘制掺杂分布图。在本文中,我们研究了基于太赫兹方法的破坏性但分辨率更高的版本,以绘制活化掺杂剂的分布图并增强已经开发的非破坏性方法。在本论文中开发的轮廓映射方法的基本思想是对要映射的掺杂轮廓的晶片薄层(低至10 nm以下)进行阳极氧化,然后氧化为二氧化硅。由于太赫兹探针看不到氧化硅薄膜中的掺杂剂原子和任何自由载流子,因此该阳极氧化步骤非常有效地从要绘制的掺杂轮廓中去除了“薄层”。通过仅在掺杂曲线的“剩余”非氧化部分进行检测的阳极氧化和太赫兹测量之间进行迭代,与仅对钨的单次非破坏性测量相比,就可以以更高的精度重构掺杂曲线。在本技术的非破坏性版本中使用的阳极氧化轮廓。在本论文中,我们探索了使用自由空间太赫兹脉冲的基于阳极氧化的掺杂轮廓映射变化的所有方面。这包括使用室温电化学氧化工艺对二氧化硅薄膜生长的研究。蚀刻程序提供了在连续的阳极氧化和太赫兹测量步骤之间去除的选项。将连续阳极氧化型材的THz-TDS测量值与薄层电阻和SIMS测量值进行比较,以基准测试和改进新技术。

著录项

  • 作者

    Tulsyan, Gaurav.;

  • 作者单位

    Rochester Institute of Technology.;

  • 授予单位 Rochester Institute of Technology.;
  • 学科 Materials science.;Optics.;Chemistry.
  • 学位 M.S.
  • 年度 2015
  • 页码 69 p.
  • 总页数 69
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 公共建筑;
  • 关键词

  • 入库时间 2022-08-17 11:52:41

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