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首页> 外文期刊>Journal of Electronic Materials >Analysis of the Electrical Properties of Different HgCdTe Passivations for Infrared Detectors
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Analysis of the Electrical Properties of Different HgCdTe Passivations for Infrared Detectors

机译:红外探测器不同HGCDTE钝化电特性分析

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Passivation of HgCdTe is known to be a key point in the making of high performance cooled infrared imagers. In this work, the electrical properties of the passivation layer of n-type mid-wave HgCdTe layers are investigated, using metal-insulator-semiconductor (MIS) structures. Several CdTe based passivation stacks are explored, deposited by two different techniques. Some stacks also include a graded bandgap zone between the semiconductor and the passivation layer. Capacitance versus voltage (CV) measurements are conducted on every sample, and the different passivation structures are then compared with regard to their electrical properties. CV measurements can be challenging to interpret in this type of material, thus additional experimental techniques and numerical simulation tools are often useful in supporting a given interpretation. Special attention is taken concerning doping values extracted from capacitance voltage curves, compared to other techniques such as the Hall Effect or secondary ion mass spectrometry (SIMS). An apparent over-doping is witnessed at the interface of some samples, which can be explained by a defective interface. It is shown that an additional annealing on these structures moves the interface closer to flat band conditions and reduces the amount of excess charge in the passivation layer and defects at the interface. Nevertheless, a Fermi level pinning phenomenon has been evidenced on some of the samples, even when an additional annealing was performed, highlighting the presence of a huge interface trap density on the band edges. In some cases, interface traps are identified and characterized accurately by the conductance method. Their density is found to be in the 10(11) cm(-2) eV(-1) range. A strong dependence on photon flux is observed for some types of interface defects. Two-dimensional (2D) finite element simulation of MIS structures are developed in parallel to support the analysis of the measurements, with an emphasis on photon flux dependence and graded bandgap layer effect. Several models of the electronic affinity of HgCdTe versus compositions from literature are tested. One of them provides a good fit to measurements.
机译:已知HGCDTE的钝化是制作高性能冷却红外成像仪的关键点。在这项工作中,使用金属 - 绝缘体 - 半导体(MIS)结构研究了N型中波HGCDTE层的钝化层的电特性。探索了几种基于CDTE的钝化堆栈,由两种不同的技术沉积。一些堆叠还包括半导体和钝化层之间的分级带隙区域。在每个样品上进行电容与电压(CV)测量,然后将不同的钝化结构与其电性能进行比较。在这种类型的材料中解释CV测量可能是具有挑战性的,因此额外的实验技术和数值模拟工具通常用于支持给定的解释。关于从电容电压曲线提取的掺杂值的特殊注意,与其他技术(如霍尔效应或二次离子质谱)(SIMS)相比,从电容电压曲线提取。在一些样品的界面中目睹一种明显的过掺杂,这可以通过缺陷界面来解释。结果表明,这些结构上的额外退火使界面更靠近扁平带状条件,并减少钝化层中的过量电荷量和界面处的缺陷。然而,即使在进行额外的退火时,一些样品已经证明了费米水平钉扎现象,突出了带边缘上的巨大界面陷阱密度的存在。在某些情况下,通过电导方法识别和表征界面陷阱。它们的密度被发现在10(11)厘米(-2)EV(-1)范围内。对于某些类型的界面缺陷,观察到对光子通量的强烈依赖。二维(2D)MIS结构的有限元模拟并行开发,以支持测量的分析,重点是光子通量依赖性和分级带隙层效应。测试了HGCDTE与文献组成的若干模型进行了测试。其中一个提供了良好的测量。

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