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Fabrication Method of Surface Passivation Layer on HgCdTe for Infrared Sensor

机译:HgCdTe表面红外钝化层的制备方法

摘要

the present invention is used in the semiconductor HgCdTe infrared photoelectric sensing element to produce tooling as ZnS, CdS, such as sulfur ( S) to form a surface coating of a material containing an element through the surface treatment of the substrate to a method for forming a surface protective layer having an electrical characteristic of good quality. ; to form a surface protective film of the method of the present invention HgCdTe is a step for wet-etching the semiconductor surface to remove a native oxide film on the semiconductor surface, a wet etching process that HgCdTe semiconductor surface comprising a surface treated with a sulfur-containing solution to form a sulfide layer on the surface material and the sulphide material surface layer is formed depositing a ZnS or CdS on and a step of forming a surface protective layer. ; In accordance with the present invention, the surface of good quality which can significantly reduce a surface leakage current when producing a photoelectric device using a pressure type HgCdTe it is possible to obtain a protective layer.
机译:本发明用于半导体HgCdTe红外光电传感元件中,以生产诸如ZnS,CdS之类的工具,如硫(S),通过对基板进行表面处理,形成包含元素的材料的表面涂层,形成一种方法。具有良好电特性的表面保护层。 ;形成本发明方法的表面保护膜HgCdTe是湿法刻蚀半导体表面以去除半导体表面上的自然氧化膜的步骤,湿法刻蚀工艺是使HgCdTe半导体表面包括经硫处理的表面在表面材料上形成硫化物层并在表面上形成ZnS或CdS的含硫化物的溶液形成表面保护层的步骤。 ;根据本发明,当使用压力型HgCdTe制造光电器件时,可以显着降低表面漏电流的高质量表面可以得到保护层。

著录项

  • 公开/公告号KR100543490B1

    专利类型

  • 公开/公告日2006-01-23

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040047423

  • 申请日2004-06-24

  • 分类号G01J1/02;

  • 国家 KR

  • 入库时间 2022-08-21 21:24:26

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