Microstructure and properties of in-situ TiC reinforced copper nanocomposites fabricated via long-term ball milling and hot pressing

摘要

Cu-matrix nanocomposites reinforced with in-situ TiC were fabricated using long-term ball milling and hot pressing. Their hardness and electrical conductivity simultaneously increased with the enlargement of ball milling time after 84 h. The novel findings provide a potentially competitive strategy for developing the high-performance Cu-based composite materials. The improved electrical properties were due to the fraction increase of micro-sized pure Cu areas. The enhanced hardness resulted from the formation of composite areas that contained the nano-sized Cu and TiC. Such microstructure depended on the refinement and more homogeneous mixing of Cu and Ti nanopowders caused by enlarging ball milling time. (C) 2018 Published by Elsevier B.V.