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机译:通过超声波辅助芯片附件增强SN加Cu复合焊料的固体/液态界面冶金反应
Harbin Inst Technol Shenzhen State Key Lab Adv Welding &
Joining Sch Mat Sci &
Engn Shenzhen 518055 Peoples R China;
Harbin Inst Technol Shenzhen State Key Lab Adv Welding &
Joining Sch Mat Sci &
Engn Shenzhen 518055 Peoples R China;
Harbin Inst Technol Shenzhen State Key Lab Adv Welding &
Joining Sch Mat Sci &
Engn Shenzhen 518055 Peoples R China;
Harbin Inst Technol Shenzhen State Key Lab Adv Welding &
Joining Sch Mat Sci &
Engn Shenzhen 518055 Peoples R China;
Intermetallics; Liquid-solid reactions; Mechanical properties; Phase transitions; Scanning electron microscopy;
机译:通过超声波辅助芯片附件增强SN加Cu复合焊料的固体/液态界面冶金反应
机译:凸点金属化条件下Sn-Ag-Cu和Sn-In-Ag-Cu焊料与Ni-P的液相和固态界面反应
机译:凸块冶金学中β-Sn晶粒与Cu和Ni(P)界面反应对Sn-Ag和Sn-Cu焊料中β-Sn晶粒的晶体取向的影响
机译:Sn-Ag-Cu-Fe复合焊料与Cu基底之间的液相界面反应
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:电流增强Cu-Sn5界面反应中Cu6Sn5金属间化合物的生长动力学
机译:无铅焊接过程中冶金和液固界面反应动力学