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Metallurgy and Kinetics of Liquidndash;Solid Interfacial Reaction during Lead-Free Soldering

机译：无铅焊接过程中冶金和液固界面反应动力学

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Jin Liang; Nader Dariavach; Paul Callahan; Dongkai Shangguan;
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年度 2006
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1. Metallurgy and Kinetics of Liquid - Solid Interfacial Reaction during Lead-Free Soldering [J] . Jin Liang, Nader Dariavach, Paul Callahan Materials transactions . 2006,第2期

机译：无铅焊接过程中液固界面反应的冶金学和动力学
2. Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders [J] . M.L.HUANG, T.LOEHER, D.MANESSIS, Journal of Electronic Materials . 2006,第1期

机译：化学镀Ni-P与锡基无铅焊料固态界面反应中金属间化合物的形态和生长动力学
3. GROWTH KINETICS OF INTERMETALLIC COMPOUNDS DURING INTERFACIAL REACTIONS BETWEEN SnAgCuGa LEAD-FREE SOLDER AND Cu SUBSTRATE [J] . Chen HuiMing, Shang Genfeng, Hu Wang Yi, Powder Metallurgy and Metal Ceramics . 2017,第1a2期

机译：脊髓糖粉无铅焊料和Cu基材之间界面反应过程中金属间化合物的生长动力学
4. Interfacial reactions between Cu single crystals and lead-free solders during solid-state aging [C] . Liu Ting, Huang Mingliang, Zhao Ning International Conference on Electronic Packaging Technology and High Density Packaging . 2012

机译：固态时效过程中，铜单晶与无铅焊料之间的界面反应
5. Wetting kinetics and interfacial reaction of lead-based and lead-free solder alloys on copper and nickel metallizations in electronic packaging. [D] . Kim, Harqkyun. 1996

机译：铅基和无铅焊料合金在电子包装中铜和镍金属上的润湿动力学和界面反应。
6. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders [O] . Tomi Laurila, Vesa Vuorinen 2009

机译：镍金属化与各种无铅焊料之间界面反应的热力学动力学综合分析
7. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders [O] . Tomi Laurila, Vesa Vuorinen 2009

机译：Ni金属化与各种无铅钎料界面反应的热力学 - 动力学分析

Metallurgy and Kinetics of Liquidndash;Solid Interfacial Reaction during Lead-Free Soldering

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