首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of filler metal composition on microstructure and mechanical properties of electron beam welded titanium/copper joint
【24h】

Effect of filler metal composition on microstructure and mechanical properties of electron beam welded titanium/copper joint

机译:填料金属组合物对电子束焊接钛/铜接头微观结构和力学性能的影响

获取原文
获取原文并翻译 | 示例
       

摘要

Electron beam welding of titanium to copper has been performed with different Cu-V filler metals. Microstructure, mechanical properties and fracture behavior were investigated. Compared with the welded joint without filler metal, the lower V content in Cu75V25 filler metal resulted in the formation of fine Ti-Cu compounds in the interface of TA15 side. Thus, the joint showed a lower tensile strength and fractured along the interfacial reactive layer. When V content is over 34 wt% in the filler metal, the interfacial microstructure near TA15 side formed cellular (Ti,V) solid solution to replace the Ti-Cu compounds, which improved the mechanical properties of the joint. As a result, the joint with Cu66V34 filler metal displayed the highest tensile strength (384 MPa), approaching 82% of that of the copper base metal (BM), and fractured in heat affected zone (HAZ) of copper side, due to the local softening by grains coarsening. In spite of the formed solid solution at the interface, the joint welded with Cu34V66 filler metal containing higher V content, produced amount of pores and unmelted V alloy, which resulted in the decrease of tensile strength down to 55% of that of the copper BM. (C) 2018 Elsevier B.V. All rights reserved.
机译:用不同的Cu-V填充金属进行钛钛的电子束焊接。研究了微观结构,机械性能和裂缝行为。与没有填充金属的焊接接头相比,Cu75V25填料金属中的较低V含量导致在Ta15侧的界面中形成细Ti-Cu化合物。因此,关节显示较低的拉伸强度并沿着界面反应层破裂。当V含量超过34wt%的填充金属时,TA15侧附近的界面微观结构形成蜂窝状(Ti,V)固溶体,以替代Ti-Cu化合物,其改善了接头的机械性能。结果,具有Cu66V34填充金属的关节呈现最高的拉伸强度(384MPa),接近铜基贱金属(BM)的82%,并且由于铜侧的热影响区(HAZ)中的裂缝裂缝,由于籽粒粗化的局部软化。尽管在界面处形成了固体溶液,但是用Cu34V66填充金属焊接含有较高的V含量,产生的孔和未熔化的V合金,这导致拉伸强度降低至铜BM的55% 。 (c)2018年elestvier b.v.保留所有权利。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号