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Effect of Cu66V34 filler thickness on the microstructure and properties of titanium/copper joint by electron beam welding

机译:Cu66V34填料厚度对电子束焊接钛/铜接头微观结构和性能的影响

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摘要

The joint with 1.0mm Cu66V34 filler metal produced a large amount of unmelted V alloy, weakening the joining quality of Ti/Cu joint. Due to the decreased thickness of filler metal, the melting quantity of Ti increased notably in the joint with 0.5mm Cu66V34 alloy, resulting in the formation of Ti-Cu compounds. The 0.7mm Cu66V34 filler metal could restrain the Ti-Cu compounds formed in the joint. The microstructure in zone A3 and FZ was mainly characterized by solid solution phases including (Ti,V) solid solution and Cu solid solution, improving the bonding strength at the interface of titanium side. The joint with 0.7mm Cu66V34 alloy presented the highest tensile strength of 384 MPa, approaching similar to 80% of that of the copper base metal, and fractured in the HAZ of copper side, due to local softening by grains coarsening.
机译:带1.0mm Cu66V34填充金属的接头产生了大量未熔化的V合金,削弱了Ti / Cu关节的连接质量。 由于填充金属的厚度下降,Ti的熔化量显着增加,其中接头具有0.5mm Cu66V34合金,导致形成Ti-Cu化合物。 0.7mm Cu66V34填充金属可以抑制在关节中形成的Ti-Cu化合物。 区域A3和FZ的微观结构主要是通过固体溶液相表征,包括(Ti,V)固溶体和Cu固溶体,提高钛侧界面处的粘合强度。 具有0.7mm Cu66V34合金的接头呈现了384MPa的最高拉伸强度,接近铜基金属的80%,并在铜侧的HAZ中裂缝,由于籽粒粗化局部软化。

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