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Effect of a copper filler metal on the microstructure and mechanical properties of electron beam welded titanium-stainless steel joint

机译:铜填充金属对电子束焊接钛不锈钢接头组织和力学性能的影响

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摘要

Cracking in an electron beam weld of titanium to stainless steel occurred during the cooling process because of internal thermal stress. Using a copper filler metal, a crack free joint was obtained, which had a tensile strength of 310 MPa. To determine the reasons for cracking in the Ti/Fe joint and the function of the copper filler metal on the improvement of the cracking resistance of the Ti/Cu/Fe joint, the microstructures of the joints were studied by optical microscopy, scanning electron microscopy and X-ray diffraction. The cracking susceptibilities of the joints were evaluated with microhardness tests on the cross-sections. In addition, microindentation tests were used to compare the brittleness of the intermetallics in the welds. The results showed that the Ti/Fe joint was characterized by continuously distributed brittle intermetallics such as TiFe and TiFe(Cr)_2 with high hardness (-1200 HV). For the Ti/Cu/Fe joint, most of the weld consisted of a soft solid solution of copper with dispersed TiFe intermetallics. The transition region between the weld and the titanium alloy was made up of a relatively soft Ti-Cu intermetallic layer with a lower hardness (~ 500 HV). The formation of soft phases reduced the cracking susceptibility of the joint.
机译:由于内部热应力,在冷却过程中钛与不锈钢的电子束焊缝出现了裂纹。使用铜填充金属,获得无裂纹的接头,其抗张强度为310MPa。为了确定Ti / Fe接头开裂的原因以及铜填充金属对提高Ti / Cu / Fe接头的抗开裂性的作用,通过光学显微镜,扫描电子显微镜研究了接头的微观结构。和X射线衍射。通过在横截面上的显微硬度测试来评估接头的开裂敏感性。此外,微压痕测试用于比较焊缝中金属间化合物的脆性。结果表明,Ti / Fe接头具有连续分布的脆性金属间化合物,例如TiFe和TiFe(Cr)_2,具有高硬度(-1200 HV)。对于Ti / Cu / Fe接头,大部分焊缝由铜与分散的TiFe金属间化合物的软固溶体组成。焊缝和钛合金之间的过渡区域由硬度较低(约500 HV)的较软的Ti-Cu金属间化合物层组成。软相的形成降低了接头的开裂敏感性。

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