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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Enhancing thermoelectric performance of BiSbSe3 through improving carrier mobility via percolating carrier transports
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Enhancing thermoelectric performance of BiSbSe3 through improving carrier mobility via percolating carrier transports

机译:通过通过渗透载体运输改善载流子迁移率来提高BISBSE3的热电性能

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摘要

BiSbSe3 is a promising medium-temperature thermoelectric material on account of its intrinsically low thermal conductivity. To further enhance the thermoelectric performance in n-type BiSbSe3, we conduct Br doping at Se sites to optimize its carrier concentration and electrical conductivity, finally a maximum ZT of similar to 0.8 in nanostructured BiSb(Se0.94Br0.06)(3) is obtained at 700 K through mechanical alloying. Based on the optimal BiSb(Se0.94Br0.06)(3) composition, we perform percolation effect with mixed grain sizes in nanoscale and microscale to enhance carrier mobility. It is found that carrier mobility is favorably improved by the addition of microscale grains (similar to 30 mu m) in nanostructured BiSb(Se0.94Br0.06)(3) matrix due to the reduced grain boundaries to carrier scattering, which benefits high electrical conductivity and power factor. Simultaneously, the BiSb(Se0.94Br0.06)(3) matrix with mixed grain sizes still maintains very low thermal conductivity due to its intrinsically strong lattice anharmonicity. Owing to the optimized electrical properties and maintained low thermal conductivity, we obtain a maximum ZT value of similar to 1.0 at 700 K in BiSb(Se0.94Br0.06)(3)-4C matrix with 40% microscale grains. This work provides a feasible method to optimize thermoelectric performance by designing microstructure with percolation effect. (C) 2020 Elsevier B.V. All rights reserved.
机译:BiSbSe3是由于其固有的低的热导率的一个有前途的中温热电材料。为了进一步提高在n型BiSbSe3热电性能,我们在硒位点进行溴掺杂以优化其载流子浓度和电导率,最后的类似的最大ZT〜0.8在纳米结构BISB(Se0.94Br0.06)(3)是在通过机械合金化700ķ获得。基于最优BISB(Se0.94Br0.06)(3)组合物中,我们执行渗滤效果与在纳米级和微米级混合晶粒尺寸,以提高载流子迁移率。据发现,载流子迁移有利地通过加入微量晶粒的(类似30微米)在纳米结构化BISB(Se0.94Br0.06)(3)矩阵改善由于减少了晶界载体飞散,有利于高的电电导率和功率因数。同时,BISB(Se0.94Br0.06)(3)混合的晶粒尺寸基质仍然保持非常低的导热性,由于其固有的强晶格非谐。由于优化的电性能,并保持低的导热性,我们在BISB 700 K(Se0.94Br0.06)(3)-4℃,用40%微尺度晶粒矩阵获得的类似〜1.0的最大ZT值。这项工作提供了一种可行的方法通过用渗滤效果设计的微结构,以优化的热电性能。 (c)2020 Elsevier B.v.保留所有权利。

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