Investigation on the formation of surface defects of OFHC copper in diamond micro-grooving process

摘要

Surface quality plays a vital role in fabricating high-precision components. Taper cutting experiment with increased depth of cut from 0 to 20 mu m was conducted on oxygen-free high conductivity (OFHC) copper and C37700 brass workpiece in this paper. It was found that surface delamination phenomenon occurred in diamond micro-grooved surface of OFHC copper workpiece at a depth of cut larger than 11 mu m, while there was no delamination being found on brass workpiece. It was suspected that the formation of surface delamination on OFHC copper workpiece was influenced by the plastic deformation and stress state of the material in the subsurface area in diamond micro-machining process.