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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Surface defect elimination in microgrooving of electroless nickel phosphide plating layer by brittleness enhancement
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Surface defect elimination in microgrooving of electroless nickel phosphide plating layer by brittleness enhancement

机译:通过脆性增强消除无电磷化镍镀层的微型渗透消除

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摘要

Electroless nickel phosphide (Ni-P) plating is used to fabricate microgrooves for precision glass molding (PGM) due to its excellent mechanical properties as a mold material. To achieve a high-quality microgroove fabrication, the causes of the machining defect, like burrs on the mold surface during the microgrooving of amorphous nickel phosphide (a-Ni-P) by single-point diamond cutting, are investigated. We find that the burrs can be eliminated by increasing the brittleness of a-Ni-P, so the brittleness enhancement of the material is conducted by crystallization. Then, the machined surface and the chip morphology during cutting crystalline nickel phosphide (c-Ni-P) are analyzed and compared with that during a-Ni-P microgrooving. Through this innovation, the surface quality of the microgroove is improved with minimized burrs.
机译:由于其作为模具材料的优异机械性能,化学镍磷化镍(Ni-P)电镀用于制造用于精密玻璃模塑(PGM)的微型侵蚀剂。 为了实现高质量的微血管制造,研究了通过单点金刚石切割在微晶镍磷化物(A-Ni-P)期间模具表面上的加工缺陷的原因,如单点金刚石切割。 我们发现可以通过增加A-Ni-P的脆性来消除毛刺,因此通过结晶进行材料的脆性增强。 然后,分析切割结晶镍磷化镍(C-Ni-P)期间的加工表面和芯片形态,并与在A-Ni-P微液中进行比较。 通过这种创新,微型槽的表面质量得到了改善,最小化毛刺。

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