METHOD FOR CONSTITUTING ELECTROLESS NICKEL PLATING LAYER ON METALLIC MOLD SURFACE AND METALLIC MOLD FOR RESIN SEALING OF ELECTRONIC PARTS

摘要

PURPOSE:To improve the adhesive property of a Ni plating layer and the release property of a resin molding by interposing a plating layer contg. elements having a high diffusion coefft. to the blank material of the metallic mold and the electroless Ni plating layer between both at the time of forming the above- mentioned plating layer on the above-mentioned surface. CONSTITUTION:The electroless Ni plating layer A is formed on the blank mate rial surface of the metallic mold for the resin sealing and molding of electronic parts, for example, a passage 17 for transporting of a molten resin material consisting of the upper mold cavity 171 and upper mold gate 172 corresponding to the position of a pot 15, upper and lower cavities 111, 121, an air vent 112, etc. The plating layer C, such as Cu plating or electrolytic Ni plating, contg. the elements having the high diffusion coefft. to the blank material surface B of the metallic mold and the Ni plating layer A is interposed between both. The plating layer C to be interposed is preferably formed as the film as thin as about 0.1 to 5mu.