Mold release capability of 'Teflon' films fused onto metallic molds.

摘要

Teflon film, applied as a fused coating to metal molds and gluing fixtures, can act as a release medium without adhering to an epoxy resin surface such as Hysol 13-009. This mold release capability of 'Teflon' is useful when contamination of a resin surface cannot be tolerated. 'Teflon' and Ram 225 (Silicone) are compared as release agents. They are about equal in terms of the force required to separate a mold from its resin casting. 'Teflon' is superior in its resin casting cleanliness, but its film is susceptible to mechanical damage. Considering these qualities, 'Teflon' can be a useful material, but its application must be chosen with care.