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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Optimal parameter ranges of material removal depth of abrasive cloth wheel polishing based on sensitivity analysis
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Optimal parameter ranges of material removal depth of abrasive cloth wheel polishing based on sensitivity analysis

机译:基于灵敏度分析的研磨布轮抛光材料去除深度的最佳参数范围

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摘要

Uniform material removal depth has an important influence on the profile accuracy and surface quality of the blisk blades in polishing. In order to guarantee the consistence of the polishing removal depth, a preferred method of polishing process parameter range based on sensitivity analysis is proposed. Firstly, the sensitive process parameters of polishing material removal depth were determined by four-factor three-level orthogonal experiments. Then, the three-factor central composite sequential (CCD) design experiment in the response surface method is used to obtain the quadratic regression empirical prediction model of polishing depth by multilinear regression through Minitab software, and the polishing material removal depth prediction model is analyzed significantly. Secondly, a mathematical model of relative sensitivity is established to determine the method of dividing the stable and unsteady domains of the process parameters, and the stable domain of each polishing process parameter and the sensitivity to the polishing removal depth were obtained. Finally, the comparative experiment verification was carried out by blisk polishing. Abrasive cloth wheel which is 12 mm in diameter and P600# in abrasive size and has abrasive of Green Sic is used to the polishing of TC4 titanium alloy blade. The results show that the optimal stability ranges of significant parameters through sensitivity analysis are as follows: compression amount within [0.6 mm, 0.8 mm], rotation speed within [5000 r/min, 6000 r/min] and feed speed within [200 mm/min, 400 mm/min]. The depth of polishing in the stable domain is the most sensitive to the compression amount, followed by the speed, and the feed speed sensitivity is the lowest. The optimized polishing process parameters effectively reduce the fluctuation of the removal depth, and the surface quality has greatly improved by using the optimized polishing parameters.
机译:均匀的材料去除深度对在抛光的叶盘叶片的轮廓精度和表面质量有重要影响。为了保证抛光去除深度的一致性,抛光基于灵敏度分析过程参数范围的优选方法,提出了首先,抛光材料去除深度的敏感的工艺参数是由四因素三电平正交实验确定。然后,将三因素中心组合顺序(CCD)设计实验在响应面方法被用于获得通过Minitab的软件由多线性回归研磨深度的二次回归经验预测模型,并且抛光材料去除深度预测模型显著分析。其次,相对灵敏度的数学模型被建立,以确定将所述稳定和工艺参数的不稳定结构域,并且每个抛光工艺参数的稳定结构域和在抛光去除深度灵敏度获得的方法。最后,对比实验证实由叶盘抛光进行。砂布轮,其是直径为12mm和在磨料尺寸P600#和具有磨料绿碳化硅的用于TC4钛合金叶片的抛光。结果表明,可通过灵敏度分析显著参数的最佳稳定性范围如下:内压缩量[0.6毫米,0.8 mm]时,内旋转速度5000转/分,6000转/分]和[200毫米的范围内进给速度/分钟400毫米/分钟]。在稳定域抛光的深度是到压缩量,其次是速度最敏感的,并且进给速度灵敏度是最低的。优化的抛光工艺参数有效地降低了去除深度的波动,并且表面质量已经通过使用优化的抛光参数大大提高。

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