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机译:基于灵敏度分析的研磨布轮抛光材料去除深度的最佳参数范围
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ Sch Mech Engn Xian 710072 Shaanxi Peoples R China;
Polishing; Removal depth; Sensitivity analysis; Optimal intervals; Polishing process parameters;
机译:基于灵敏度分析的研磨布轮抛光材料去除深度的最佳参数范围
机译:用磨料布抛光抛光杆抛光杆振动特性研究
机译:通过具有不同磨料粒径的十字图案抛光垫抛光蓝宝石晶片的磨料去除深度
机译:基于磨料轨迹的硅片化学机械抛光材料去除率分析
机译:电镀CBN砂轮和配对抛光的材料去除模型和预期寿命。
机译:工艺参数对微光学模具振动辅助抛光中材料去除的影响
机译:利用软磨料砂轮(saGW)去除si晶片化学机械研磨(CmG)的材料去除机理