...
首页> 外文期刊>Nanotechnology >Directed assembly-based printing of homogeneous and hybrid nanorods using dielectrophoresis
【24h】

Directed assembly-based printing of homogeneous and hybrid nanorods using dielectrophoresis

机译:基于组装的基于组装的均匀和杂交纳米棒使用介电泳

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Printing nano and microscale three-dimensional (3D) structures using directed assembly of nanoparticles has many potential applications in electronics, photonics and biotechnology. This paper presents a reproducible and scalable 3D dielectrophoresis assembly process for printing homogeneous silica and hybrid silica/gold nanorods from silica and gold nanoparticles. The nanoparticles are assembled into patterned vias under a dielectrophoretic force generated by an alternating current (AC) field, and then completely fused in situ to form nanorods. The assembly process is governed by the applied AC voltage amplitude and frequency, pattern geometry, and assembly time. Here, we find out that complete assembly of nanorods is not possible without applying both dielectrophoresis and electrophoresis. Therefore, a direct current offset voltage is used to add an additional electrophoretic force to the assembly process. The assembly can be precisely controlled to print silica nanorods with diameters from 20-200 nm and spacing from 500 nm to 2 mu m. The assembled nanorods have good uniformity in diameter and height over a millimeter scale. Besides homogeneous silica nanorods, hybrid silica/gold nanorods are also assembled by sequentially assembling silica and gold nanoparticles. The precision of the assembly process is further demonstrated by assembling a single particle on top of each nanorod to demonstrate an additional level of functionalization. The assembled hybrid silica/gold nanorods have potential to be used for metamaterial applications that require nanoscale structures as well as for plasmonic sensors for biosensing applications.
机译:使用纳米粒子定向组装的印刷纳米和微观三维(3D)结构在电子,光子和生物技术中具有许多潜在的应用。本文介绍了一种可再现且可扩展的3D型介电泳组装方法,用于从二氧化硅和金纳米颗粒印刷均匀二氧化硅和杂化二氧化硅/金纳米棒。在由交流(AC)场产生的介电泳力下,将纳米颗粒组装成图案化通孔,然后完全融合以形成纳米棒。装配过程由应用的交流电压幅度和频率,图案几何和组装时间控制。在这里,我们发现在不施加介电泳和电泳的情况下,不可能实现纳米棒的完整组装。因此,使用直流偏移电压向组装过程添加额外的电泳力。可以精确地控制组件以印刷直径20-200nm的二氧化硅纳米棒,并将500nm至2μm间隔。组装的纳米棒在直径和高度上具有良好的均匀性,在毫米尺度上具有良好的均匀性。除了均匀的二氧化硅纳米棒外,还通过顺序组装二氧化硅和金纳米颗粒组装混合动力车二氧化硅/金纳米棒。通过在每个纳米棒的顶部组装单个粒子来进一步说明组装过程的精度,以证明额外的官能化水平。组装的混合二氧化硅/金纳米棒具有用于需要纳米级结构以及用于生物传感器应用的等离子体传感器的超级材料应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号