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A comprehensive model for sub-10nm electron-beam patterning through the short-time and cold development

机译:通过短时间和冷发射的亚10nm电子束图案综合模型

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In this study, we propose a set of single-spot experiment to construct a comprehensive model of electron-beam lithography to describe the relation among the incident electrons, resist, and the development conditions such as durations and temperatures. Through the experiments, small feature can be achieved by performing a short-time development due to the high acceleration voltage and large depth of focus of electron-beam system. The singular point in the beginning of the development is also observed in our model and supported by the experimental data. In addition, we verify the characteristic region of each incident spot induced by the point spread function of the electron-beam system. We further fabricate the single line with narrow groove width by utilizing the results from single-spot experiment at low developing temperatures. The line is formed by arranging a series of incident points with a distance close to the characteristic radius. This method can eliminate the proximity effect effectively and thus the groove width is scaled down to 8 nm. By adopting the successful experience in the single line formation, dense array with narrow linewidth is also demonstrated under well suppression of the proximity effect. The minimum groove width of 9 nm with 30 nm pitch is achieved with 5 s development time at -10 degrees C. Finally, the exceptional capability of pattern transfer is presented due to the high aspect ratio of the resist.
机译:在这项研究中,我们提出了一组单点实验来构建电子束光刻综合模型,以描述入射电子,抗蚀剂和诸如持续时间和温度的开发条件之间的关系。通过实验,通过对电子束系统的高加速电压和大深度焦深,可以通过执行短时间开发来实现小功能。在我们的模型中也观察到开发开始的奇异点,并由实验数据支持。另外,我们验证由电子束系统的点扩散函数引起的每个入射光点的特征区域。我们通过利用低显影温度下的单点实验的结果进一步用窄槽宽制造单线。通过布置一系列入射点,该距离接近特征半径的距离来形成。该方法可以有效地消除接近效果,因此槽宽度缩放到8nm。通过采用单线形成的成功经验,在较好的抑制邻近效应的情况下也表现出具有窄线宽的密集阵列。在-10℃下,在5秒的开发时间实现9nm具有30nm间距的最小凹槽宽度。最后,由于抗蚀剂的高纵横比,提出了图案传递的特殊能力。

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