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Nanofabrication of plasmonic structures on insulating substrates by resist-on-metal bilayer lift-off

机译:抗抗型金属双层剥离型抗血浆结构的纳米型结构

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摘要

In last few decades, micro- and nano-fabrication techniques based on photolithography and electron beam lithography have advanced greatly, mainly in the field of semiconductor fabrication. Such techniques are generally transferrable to the fabrication of plasmonic structures and metamaterials. However, plasmonic devices often require a transparent insulating substrate to be operational at visible or near-infrared wavelengths. Here we report a resist-on-metal bilayer lift-off technique enabling the fabrication of plasmonic structures on insulating substrates. The metal layer under the resist eliminates major difficulties in lithography, such as charging during electron beam exposure and uncontrolled diffuse optical scattering during photolithography. In addition, the resist-on-metal bilayer can be migrated to different substrates with minimal process alteration, because the material properties of the substrate, such as secondary electron emission or optical reflectance, become irrelevant due to the shielding provided by the metal layer. As demonstrations, we fabricate large-scale plasmonic. waveguides and Bragg gratings, adiabatically-modulated plasmonic waveguide couplers, and plasmonic nanoantenna arrays using the resist-on-metal bilayer lift-off process. The process can also be used to define structures formed of other materials such as dielectrics.
机译:在过去的几十年中,基于光刻和电子束光刻的微型和纳米制造技术大大提高,主要是在半导体制造领域。这些技术通常是转移到等离子体结构和超材料的制造。然而,等离子体装置通常需要透明绝缘基板以可见或近红外波长可操作。在这里,我们报告了一种抗抗蚀金属双层剥离技术,从而能够在绝缘基板上制造等离子体结构。抗蚀剂下的金属层消除了光刻中的主要困难,例如电子束曝光期间的充电,并且在光刻期间的不受控制的漫射光学散射。另外,抗蚀剂 - 金属双层可以用最小的过程改变迁移到不同的基板,因为由于金属层提供的屏蔽,基板的材料特性如二次电子发射或光学反射。作为示范,我们制造了大规模的等级。波导和布拉格光栅,绝热调制的等离子体波导耦合器和等离子体纳米天线阵列,使用抗蚀剂对致命的金属双层剥离过程。该过程还可用于定义由其他材料形成的结构,例如电介质。

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