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High-performance solution processed oxide TFT with aluminum oxide gate dielectric fabricated by a sol-gel method

机译:溶胶-凝胶法制备具有氧化铝栅介质的高性能固溶处理氧化物TFT

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摘要

We have studied the fabrication of solution processed aluminumoxide (AlO_x) gate dielectric at the maximum process temperature of 300 °C for a solution based zinc-tin-oxide (ZTO) thin-film-transistor (TFT). An AlO_x layer was spin-coated from a solution of aluminum chloride (A1C13) and then annealed at 300 °C for 1 h. The breakdown electrical field and leakage current density of the AlO_x were found to be ~4 MV cm~(-1) and 63 μA cm~(-2) at 1 MV cm~(-1), respectively. The ZTO layer was prepared by spin-coating or inkjet printing as an active layer of the TFT with AlO_s gate dielectric and then annealed at 300 °C for 1 h. The TFT made using spin coating exhibited the field-effect mobility of 33 cm~2 V~(-1) s~(-1) in the saturation region, a gate swing of 96 mV dec.~(-1) and a threshold voltage of ~1.2 V and the inkjet printed TFT showed a field-effect mobility of 24 cm~2 V~(-1) is~(-1).
机译:我们已经研究了基于溶液的氧化锌锡(ZTO)薄膜晶体管(TFT)的最高工艺温度为300°C的固溶处理氧化铝(AlO_x)栅极电介质的制造。从氯化铝(AlCl 3)溶液中旋涂AlO x层,然后在300℃下退火1小时。发现AlO_x的击穿电场和漏电流密度分别为1MV cm〜(-1)〜4 MV cm〜(-1)和63μAcm〜(-2)。通过旋涂或喷墨印刷将ZTO层制备为具有AlO_s栅极电介质的TFT的活性层,然后在300℃下退火1小时。使用旋涂法制备的TFT在饱和区域的场效应迁移率为33 cm〜2 V〜(-1)s〜(-1),栅极摆幅为dec。〜(-1)和阈值在〜1.2 V的电压下,喷墨印刷的TFT的场效应迁移率为24 cm〜2 V〜(-1)is〜(-1)。

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