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The investigation of electron-phonon coupling on thermal transport across metal-semiconductor periodic multilayer films

机译:电子-声子耦合在金属-半导体周期多层膜上热传输的研究

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The cross-plane thermal conductivities of four X/Si (X = SiGe, Au, Cr, Ti) periodic multilayer films deposited by magnetron sputtering with period thicknesses of about 20 nm were investigated by a differential 3 omega method at room temperature. Structure characterization and sharp interfaces of multilayer films were confirmed by grazing incidence small angle X-ray scattering and field emission scanning electron microscopy. The measured thermal conductivities were compared with the classic heat conduction model and the two temperature model (TTM). The interfacial thermal resistance is the sum of the phonon interfacial thermal resistance and electron-phonon thermal resistance. The experimental results show great agreement with the theoretical results calculated by the TTM. It indicates that in metal-semiconductor periodic multilayered system for a relatively low coupling factor G (10(16) - 10(17) Wm(-3) K-1), the thermal conductivity of the samples is significantly affected by the electron-phonon coupling, providing a more insightful understanding of the thermal transport mechanism of the thin-film system.
机译:在室温下,通过差动3Ω法研究了通过磁控溅射沉积的四层X / Si(X = SiGe,Au,Cr,Ti)周期厚度约为20 nm的横断面热导率。通过掠入射小角X射线散射和场发射扫描电子显微镜证实了多层膜的结构表征和清晰的界面。将测得的热导率与经典热传导模型和两个温度模型(TTM)进行比较。界面热阻是声子界面热阻和电子-声子热阻之和。实验结果表明与TTM计算的理论结果非常吻合。这表明在耦合系数G(10(16)-10(17)Wm(-3)K-1)相对较低的金属-半导体周期性多层系统中,样品的热导率显着受电子-声子耦合,使您对薄膜系统的热传输机理有更深刻的了解。

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