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The effect of ductility minimum temperature in CuM25 alloy

机译:延性最低温度对CuM25合金的影响

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On the basis of high temperature ductility tests in single-phase cupronickel CuNi25 sample has been found a relation between microstructure, grain size and effect of ductility minimum temperature (DMT). Metallographic tests confirmed literature studies that cracks nucleate at points of two or three grain joints and cross-cut of twined grain with border of the grains. The non-homogeneous character of chemical composition concentrating in areas of grain joints and cracks at high temperature has been investigated by linear and point Cu and Ni analysis (EDS). Thisanalysis shows that local areas of non-equilibrium formation concentrate at this places. This fact can be accepted as one of the reasons of non-homogeneous deformation, cracking and its location at DMT. Experimental results were compared with two-dimensional finite element method (FEM) simulation results of proposed hypothesis of non-uniform deformation.
机译:在单相白铜CuNi25样品的高温延展性测试的基础上,发现了微观结构,晶粒尺寸和延展性最低温度(DMT)的影响之间的关系。金相测试证实了文献研究的结果,即裂纹在两个或三个晶粒接合点处成核,并且孪晶与晶界交界。通过线性和点Cu和Ni分析(EDS)研究了高温下化学成分集中在晶粒接头和裂纹区域的非均匀特征。该分析表明,非平衡形成的局部区域集中在此位置。这一事实可以被视为不均匀变形,开裂及其在DMT处的原因之一。将实验结果与提出的非均匀变形假设的二维有限元方法(FEM)仿真结果进行了比较。

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