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Formation of nucleation centers for vortices in Bi-2223 superconducting core by dispersed Sn nanoparticles

机译:Bi-2223超导核中分散的Sn纳米粒子形成旋涡成核中心

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In this study, we investigate the effect of the Sn diffusion at different annealing temperature in the range of 650-850 °C on the microstructural, electrical, mechanical and superconducting properties of the Bi_(1.8)-Pb_(0.4)Sr_(2.0)Ca_(2.1)Cu_(3.0)O_y materials prepared by the standard solid state reaction method with the aid of bulk density, dc resistivity (p-T), transport critical current density (J_c), X-ray diffraction (XRD), scanning electron microscopy (SEM) and Vickers microhardness (H_v) measurements. It is found that all the properties given above are significantly dependent upon both the Sn nanoparticles inserted in the Bi-2223 superconducting matrix and diffusion annealing temperature. Namely, the dc resistivity measurements indicate that all the samples exhibit the metallic behavior as a result of the electron-phonon interaction in the Bi-2223 crystal structure or logarithmic divergence in density of states at the Fermi level. Further, the normal state resistivity decreases with the enhancement of the annealing temperature owing to the increment of the metallic connection between the superconducting grains due to the optimization of the hole density and possible changes in the lattice vibration. Likewise, onset and offset critical transition temperature values tend to enhance with the diffusion annealing temperature, confirming not only the improvement of crystallinity and especially connectivity between the superconducting grains but the increment in the average grain size and mobile hole concentration in the Cu-O_2 slabs of the Bi-2223 system, as well. The decrement in the degree of the broadening stems from the degradation of the porosity,
机译:在这项研究中,我们研究了Sn扩散在650-850°C范围内的不同退火温度对Bi_(1.8)-Pb_(0.4)Sr_(2.0)的微结构,电,机械和超导性能的影响。通过标准固态反应方法借助堆积密度,直流电阻率(pT),传输临界电流密度(J_c),X射线衍射(XRD),扫描电子显微镜制备的Ca_(2.1)Cu_(3.0)O_y材料(SEM)和维氏显微硬度(H_v)测量。发现以上给出的所有性质都显着取决于插入Bi-2223超导基质中的Sn纳米颗粒和扩散退火温度。即,直流电阻率测量表明,由于Bi-2223晶体结构中的电子-声子相互作用或费米能级的密度的对数发散,所有样品均表现出金属行为。此外,归因于空穴密度的最佳化和晶格振动的可能变化,由于超导晶粒之间的金属连接的增加,常态电阻率随着退火温度的升高而降低。同样,开始和偏移的临界转变温度值往往会随扩散退火温度的升高而增加,这不仅证实了结晶度的提高,尤其是超导晶粒之间的连通性的提高,而且还证实了Cu-O_2平板中平均晶粒尺寸和活动孔浓度的增加Bi-2223系统也是如此。加宽程度的降低是由于孔隙率的降低,

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