Matsushita Electric Works has succeeded in making a new electrocon-ductive paste that can bond electronic components at a temperature of 150 C, the lowest ever in the world, as tightly as cream solders. After hardening, the resin will not melt, keeping the bonded components tightly held, even if it is reheated when the opposite side undergoes heat treatment, for instance, to mount both sides of a circuit board. The company is exploring a variety of applications for its new paste besides connecting components that cannot withstand high temperatures. It is planning to start market cultivation for the paste after April.
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