首页> 外文期刊>The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical >Role of a Pb~(2+) Stabilizer in the Electroless Nickel Plating System:A Theoretical Exploration
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Role of a Pb~(2+) Stabilizer in the Electroless Nickel Plating System:A Theoretical Exploration

机译:Pb〜(2+)稳定剂在化学镀镍体系中的作用:理论探索

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The electroless nickel plating process involves multiple chemical reactions that interrelate mutually in intricate ways and take place almost simultaneously.This work attempts to provide a theoretical template for understanding this complicated system from the role of heavy metal stabilizers.Pb~(2+) ion was selected for the study because it is the most effective species in this category.A theoretical expression of the nickel deposition rate is created by envisioning the Stern-Grahame electrical double layer presumably attached to the plating frontier (the inner Helmholtz plane) as a one-dimensional potential well and the electron transfer from the Fermi level of plating frontier to Ni~(2+) ions at the outer Helmholtz plane as the quantum tunneling effect.The deposition of P atoms is assumed to go through the oxidative-addition of hypophosphite (H_2PO_2~-) ions at Ni atoms on the plating frontier and on this basis its theoretical deposition rate is developed.Another adsorption state of H_2PO_2~- on the surface Ni atoms is proposed to form by its two oxygen atoms,and the P(I) center supplies electrons to the plating frontier through these two oxygen bridges.Establishing the relationship between Pb~(2+)-ion concentration and the Fermi level of the plating frontier (i.e.,inside the solid Ni-P alloy deposition layer on the plating substrate) is an important step for deriving the nickel and element phosphorus deposition rates.The stabilizing effect of the lead ion is attributed to its participation as the neutral atom in the lattice of the Ni-P film at the plating frontier,which results in the ascension of Fermi energy.Thus,the oxidation of hypophosphite at the plating frontier is retarded,which in turn slows down the deposition of both Ni and P that needs electrons.The dependence of the deposition rates of Ni and P on concentrations of Pb~(2+) ion was experimentally examined.It is found that the theoretical models predict well the experimental trends.The parameters designated in the theoretical model are determined through a self-consistent computation procedure.
机译:化学镀镍过程涉及多个化学反应,这些化学反应以复杂的方式相互关联并几乎同时发生。这项工作试图为从重金属稳定剂的作用理解这一复杂系统提供理论模板.Pb〜(2+)离子之所以选择此项研究是因为它是该类别中最有效的物质。镍的沉积速率的理论表达式是通过将Stern-Grahame双电层设想为附着在镀层边界(内亥姆霍兹平面)上而创建的,势阱和电子从镀层边界的费米能级转移到外亥姆霍兹平面的Ni〜(2+)离子作为量子隧穿效应.P原子的沉积经过次亚磷酸盐的氧化加成(在镀层前沿的Ni原子上有H_2PO_2〜-)离子,在此基础上发展了其理论沉积速率。提出表面H_2PO_2〜-由其两个氧原子形成,P(I)中心通过这两个氧桥将电子提供给镀层边界。建立Pb〜(2 +)-离子浓度之间的关系电镀前沿的费米能级(即在电镀基底上的固态Ni-P合金沉积层内部)是获得镍和元素磷沉积速率的重要步骤。铅离子的稳定作用归因于其镀层边界处的Ni-P膜的晶格中作为中性原子参与,这导致费米能量的提升。因此,镀层边界处的次磷酸盐的氧化被阻止,这又减慢了两者的沉积实验研究了Ni和P的沉积速率对Pb〜(2+)离子浓度的依赖性,发现理论模型很好地预测了实验趋势。通过自洽计算程序确定理论模型中的状态。

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