Atomic simulation of grain-boundary sliding and migration in copper - art. no. 012107

摘要

In this study, we present a Monte Carlo investigation, based on the embedded atom method potential, of die Sigma5 grain-boundary (GB) sliding in copper at elevated temperature. Important aspect of this approach is the implementation of simulated annealing technique. We find a variety of sliding behaviors, including coupling to migration. While our previous results showed that elevated temperature in aluminum Sigma5 GB increases the rate of migration, we did not find a temperature dependency of interface migration in copper. [References: 17]