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Mechanisms of cluster implantation in silicon: A molecular-dynamics study

机译:硅中团簇注入的机理:分子动力学研究

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Employing molecular dynamics, we have simulated collisions of various sizes of 5.7-keV silicon clusters with a silicon surface. At this energy, the simulation provides an atomistic description of the evolution of the multiple scattering process of atoms in the cluster as well as the substrate where atoms interact with each other by covalent forces. The change from the collision cascade that is characteristic in the single-ion case to the simultaneous collision process that leads to the collective motion of particles, such as macroscopic vibration of the surface and shock waves, is found by increasing the number of the atoms in the cluster. With an increase in cluster size, the impurity profile and the damaged region for the cluster ion implantation is also found to be shallower. In contrast to single-ion implantation, cluster implantation may not induce defects in deep regions, making it suitable for device design. The channeling effect is found to be mainly suppressed by the low-frequency macroscopic vibrations of the surface rather than by the amorphization of the surface caused by the impact. [S0163-1829(98)03136-1]. [References: 27]
机译:利用分子动力学,我们模拟了各种尺寸的5.7keV硅团簇与硅表面的碰撞。在这种能量下,模拟提供了原子簇和原子通过共价力相互作用的基质中原子多重散射过程演变的原子描述。通过增加原子中的原子数,可以发现从单离子情况下典型的碰撞级联到导致粒子集体运动(例如表面的宏观振动和冲击波)的同时碰撞过程的变化。集群。随着团簇尺寸的增加,还发现用于团簇离子注入的杂质分布和受损区域更浅。与单离子注入相反,簇注入可能不会在深部区域引起缺陷,使其适合于器件设计。发现通道效应主要由表面的低频宏观振动抑制,而不是由冲击引起的表面非晶化抑制。 [S0163-1829(98)03136-1]。 [参考:27]

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