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Charge redistribution among defects in heavily damaged silicon

机译:严重受损的硅中的缺陷之间的电荷重新分布

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We have studied trapping kinetics of defects during carrier capture in heavily damaged silicon, where damage was induced by MeV heavy ions at doses near but below the amorphization threshold. Using spectroscopic junction transient measurements, we provide unambiguous evidence of charge redistribution between defects. These results imply that changes in the occupancy of gap states are responsible for the deepening of emission energies with filling time, as is commonly observed in transient experiments in disordered silicon. This is in contrast to its usual explanation in terms of deepening of energy states due to hierarchical defect relaxation. [References: 17]
机译:我们已经研究了在严重受损的硅中捕获载流子期间缺陷的俘获动力学,其中由MeV重离子以接近但低于非晶化阈值的剂量诱导了损伤。使用光谱结瞬态测量,我们提供了缺陷之间电荷重新分布的明确证据。这些结果表明,随着无序硅的瞬态实验通常观察到,随着填充时间的增加,间隙态的占有率变化是发射能量加深的原因。这与它通常的解释相反,后者是由于分层缺陷松弛而导致的能量状态加深。 [参考:17]

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